Compact 5 megapixel autofocus camera module and 2 megapixel reflowable wafer level camera (Jabil Technology)

October 09, 2023

Jabil Technologies has introduced two system-on-chip camera module technologies. These two revolutionary innovations enable handset manufacturers to capture the huge market opportunities that arise in both the high and low end markets to meet the critical needs of the mobile phone market. Among them, MD6054A is a compact 5 megapixel system chip camera module with auto focus function to meet the growing consumer demand for high-end optical equipment. The module is based on industry standard 8.5x8.5x6.0mm Size package. The PW3625A, the world's first 2 megapixel reflowable wafer-level camera module, targets the huge, yet fully developed, low-cost handset market. Both models are developed by Jabil Technology's mobile product division Jabil | Green Point, which leverages the expertise of Jabil | Sypro Optics, while Jabil | Sypro Optics is a company that works with Carl Zeiss Joint venture.

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“The camera that comes with the mobile phone is now a must-have element, but the quality of the image taken by the camera itself is often worse than that of a dedicated digital camera.”, Stephen Taylor, Director of Business Unit, Jabil | Green Point Camera Module Commented on this, "Our new 5 megapixel autofocus camera module successfully solved this by enabling the optical quality and functionality of next-generation cameras, including autofocus in a compact 8.5x8.5x6.0mm package unit. Contradictions. At the same time, the growing mobile phone market offers tremendous opportunities for low-cost mobile phones. Our new wafer-level camera modules will help handset manufacturers continue to increase market share while reducing handset add-on capabilities. Cost and waveform factor. These advantages are significantly increased by implementing the camera function in the form of a system chip."

System-on-Chip Camera Module Improves Cost Effectiveness and Saves Board Space

Mobile phone manufacturers can benefit from system-on-chip camera modules, such as lower development costs. The modules are assembled and tested in a highly automated production process optimized for high throughput and low price. The image function is realized by the system chip. This module is a complete solution for high-quality images, and the module integrated on the motherboard can also be used to implement other functions.

5 megapixel camera module for autofocus in a compact 8.5x8.5x6.0 mm package

The MD6054A embedded autofocus camera module features a high-intensity lens for high-quality images even in small package units. The camera module includes a highly integrated 5 megapixel (2592 x 1944) camera chip, CMOS image sensor and integrated image signal processor (ISP) as well as high performance optics and autofocus actuators. The image signal processor integrated on the motherboard uses 1.4μm CMOS high resolution technology. It enables perfect image processing, including color reproduction and correction, contour enhancement, lens black point correction, 瑕疵 repair, auto exposure, auto white balance, and image scaling. The industry-standard 8.5 x 8.5 x 6.0 mm package makes it suitable for a wide range of mobile phones, notebooks and smartphones.

Ultra-small reflowable wafer level camera module

The PW3625A embedded camera module features advanced optics and assembly technology to produce ultra-small 5.6 x 5.7 x 3.5mm packaged optical modules. This very compact size allows the module to be used on very small and thin components that are typically required on low-cost handsets, as well as on panel frames for netbooks or other laptops. This highly integrated 2 megapixel (1600 x 1200) camera chip includes a CMOS image sensor and an image signal processor combined with wafer level optics. Image signal processor functions integrated on the board include color recovery and correction, contour enhancement, lens black point correction, 瑕疵 repair, auto exposure, auto white balance, and image scaling. The module is reflowable and is available in a 64-pin ball array package (BGA). Applications for this wafer level module include cell phones, smartphones, laptops, wireless security cameras and biometric cameras.

An added bonus is that both products offer barcode recognition, and this feature becomes more important as consumers begin to use mobile devices for purchases.

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